News
- Aug 05, 2024Technical
- Announcing Scientific Presentations by Hirano Tecseed at the 2024 ISCST Symposium（PDF:161.8 KB）
- Dec 05, 2018Technical
- The 9th Film Tech Japan (Panels are exhibited to introduce the new, two-layer FX die units, two-layer R2 units, and other features.)
- Apr 05, 2017Technical
- The 8th Film Tech Japan (Panels are exhibited to introduce the new, three-layer die units, and other features.)
- Jan 10, 2017Technical
- Convertech JAPAN 2017 (Panels are exhibited to introduce the new, grip feed equipment, three-layer die units, and other items.)
- Jun 01, 2016Technical
- Functions added to a testing machine: HB (Laminating rolls are modified so they can deliver heat.)
- Apr 06, 2016Technical
- The 7th Film Tech Japan (Panels are exhibited to introduce the new, wider (W=1200), three-layer die units, new butt splicers (CC type), and other features.)
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